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| HS-26CT32RH-T TM Data Sheet July 1999 FN4593.1 Radiation Hardened Quad Differential Line Receiver Intersil's Satellite Applications Flow TM (SAF) devices are fully tested and guaranteed to 100kRAD total dose. These QML Class T devices are processed to a standard flow intended to meet the cost and shorter lead-time needs of large volume satellite manufacturers, while maintaining a high level of reliability. The Intersil HS-26CT32RH-T is a Quad Differential Line Receiver designed for digital data transmission over balanced lines and meets the requirements of EIA Standard RS-422. Radiation Hardened CMOS processing assures low power consumption, high speed, and reliable operation in the most severe radiation environments. The HS-26CT32RH-T has an input sensitivity of 200mV (typ.) over the common mode input voltage range of 7V. The receivers are also equipped with input fail safe circuitry, which causes the outputs to go to a logic "1" when the inputs are open. TTL compatible Enable and Disable functions are common to all four receivers. Intersil's Quality Management Plan (QM Plan), listing all Class T screening operations, is also available on our website. * QML Class T, Per MIL-PRF-38535 * Radiation Performance - Gamma Dose . . . . . . . . . . . . . . . . . . . . 1 x 105 RAD(Si) - SEU and SEL . . . . . . . . . . Immune to 100MeV/mg/cm2 * EIA RS-422 Compatible Inputs * TTL Compatible Enable Inputs * Input Fail Safe Circuitry * High Impedance Inputs when Disabled or Powered Down * Low Power Dissipation 138mW Standby (Max) * Single 5V Supply * Full -55oC to 125oC Military Temperature Range Pinouts HS1-26CT32RH-T (SBDIP) CDIP2-T16 TOP VIEW Specifications Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. Detailed Electrical Specifications for the HS-26CT32RH-T are contained in SMD 5962-95631. A "hot-link" is provided from our website for downloading. AIN 1 AIN 2 AOUT 3 ENABLE 4 COUT 5 CIN 6 CIN 7 GND 8 16 VDD 15 BIN 14 BIN 13 BOUT 12 ENABLE 11 DOUT 10 DIN 9 DIN HS9-26CT32RH-T (FLATPACK), CDFP4-F16 TOP VIEW AIN AIN AOUT ENABLE COUT CIN CIN GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VDD BIN BIN BOUT ENABLE DOUT DIN DIN 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2002. All Rights Reserved Satellite Applications FlowTM (SAF) is a trademark of Intersil Corporation. HS-26CT32RH-T Functional Diagram ENABLE ENABLE DIN DIN CIN CIN BIN BIN AIN AIN + - + - + - + - DOUT COUT BOUT AOUT TRUTH TABLE INPUTS DEVICE POWER ON/OFF ON ON ON ON ON ON ON ENABLE 0 1 1 X X 1 X ENABLE 1 X X 0 0 X 0 INPUT X VID VTH (Max) VID VTH (Min) VID VTH (Max) VID VTH (Min) Open Open OUTPUT OUT HI-Z 1 0 1 0 1 1 2 HS-26CT32RH-T Die Characteristics DIE DIMENSIONS: 2140m x 3290m x 533m 25.4m (85 x 130 x 21mils 1mil) METALLIZATION: M1: Mo/Tiw Thickness: 5800A M2: Al/Si/Cu Thickness: 10kA 1kA SUBSTRATE POTENTIAL: Internally connected to VDD . May be left floating. BACKSIDE FINISH: Silicon PASSIVATION: Type: SiO2 Thickness: 8kA 1kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm 2 TRANSISTOR COUNT: 315 PROCESS: Radiation Hardened CMOS, AVLSI Metallization Mask Layout HS-26CT32RH-T AIN (1) VDD (16) BIN (15) AIN (2) (14) BIN AOUT (3) (13) BOUT ENAB (4) (12) ENAB COUT (5) (11) DOUT CIN (6) (10) DIN (7) CIN (8) GND (9) DIN All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 3 |
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